
Apps Open for Binc Scholarship to 2025 Denver Publishing Institute
Applications are open for current booksellers from a physical bookstore interested in learning about the publishing arm of the industry to apply for a scholarship to attend the Denver Publishing Institute (DPI). The scholarship, offered by the Book Industry Charitable (Binc) Foundation in collaboration with Sourcebooks and the Denver Publishing Institute at the University of Denver, is worth up to $7,000. It includes tuition, room and board, and up to $2,000 to cover travel and lost wages. Applications will be accepted through Friday, February 7.
DPI is a four-week summer program (July 13–August 8, 2025) at the University of Denver. Participants can choose to attend in person or as a remote student. DPI is taught by industry professionals who work for trade, university, textbook and independent publishers throughout the country. Recent graduates have gone on to work at Sourcebooks, Bank Square Books, Harper Collins, Penguin Group, Oxford University Press, Chicago Review Press, Pearson, and McGraw-Hill. Course and lecture topics include book marketing, manuscript editing, copyediting and proofreading, digital marketing strategies, the role of the bookstore and many publishing specific courses.
The application process—which is managed through DPI’s admission application—is open to booksellers who are currently employed (full- or part-time) at a physical bookstore with a tenure of at least 90 days and are employed by the bookstore at the time of the program. Applicants must discuss application and potential selection as scholarship recipient with their store owner/manager prior to applying for the scholarship. Booksellers can learn more and apply here.
Applications are due by Friday, Feb. 7. After you have created an account and started your application, under Program Selection → Choose College of Arts, Humanities & Social Sciences → Denver Publishing Institute, Graduate Certificate. You will be able to select if you are applying for a Binc scholarship toward the end of the application process.